Intel and TSMC to Build New Chip Facility in the US

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13:07, 07.04.2025

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Intel and TSMC are planning to set up a joint venture to produce semiconductors in the United States. This was reported by insider sources familiar with the negotiations.

Distribution and Technological Contribution

According to the insider information, TSMC will receive a 20% stake in the newly created company; how the remaining 80% will be distributed is not yet known.

It is important to note that TSMC plans to contribute its share not in the form of financial investments, but by sharing advanced chip manufacturing technologies. According to insiders, TSMC will focus on the production side, using its advanced technical processes, while Intel will provide chip design, engineering expertise, and integration into its own products.

Investment and Launch

The project is aimed not only at economic benefits, but also at strengthening the US strategic autonomy in the field of high technology. It is expected that the factory will be built in the United States, with partial government funding. The US authorities facilitated the signing of the agreement in order to stabilize Intel, which is struggling with operational difficulties.

Although official figures have not yet been announced, sources suggest that investments in the project will reach tens of billions of dollars. Construction could begin as early as 2025, and the first chips from the new fab could be produced in 2027-2028.

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